LGA 1700 Contact Frame, CPU Anti-Bending Correction Kit for 12th/13th/14th Gen - Lowers CPU Temps, Z790 Z690 B760 B660 H610 Motherboards
역대 최저
약 18,490원
$12.64
2026-04-29
역대 최고
약 19,750원
$13.50
2026-06-11
평균가
약 18,973원
$12.97
달러 가격을 현재 환율 $1 = ₩1,463 (2026-07-27 기준)로 환산한 원화입니다.
가격 변동 그래프
아마존 달러(USD) 가격을 각 날짜의 환율로 원화 환산해 표시합니다. 현재 환율 $1 = ₩1,463 (2026-07-27 기준)
그래프 로딩 중…
상품 특징
- COMPATIBILITY: Designed for LGA 1700 socket motherboards, including Z790, Z690, B760, B660, and H610 models supporting 12th, 13th, and 14th Gen processors
- PERFORMANCE: Reduces CPU temperatures by correcting the socket bending issue common in LGA 1700 platforms
- INSTALLATION: Simple mounting process requires basic tools and provides direct replacement for stock ILM (Independent Loading Mechanism)
- CONSTRUCTION: Precision-engineered frame ensures even pressure distribution across the CPU surface for optimal thermal contact
- DESIGN FEATURES: Maintains consistent contact between CPU and cooler, eliminating gaps that can impact heat transfer efficiency
- In case the item is damaged/defective upon arrival (or: if it does not work properly upon arrival), please choose between a refund or exchange. We sincerely apologize for any inconvenience in advance
스펙 정보
| 브랜드 | YEGAFE |
|---|---|
| 품번 | BSP-CF-LGA1700-V1-V2 |
| 크기 | 3.5 x 0.1 x 3 inches |