BGA Reballing Stencil Kit for Phone IC Chip Repair, Solder Paste Template Compatible with Soldering Stations

["MULTI SIZE: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.","The tin mesh solder template is made of premium stainless steel material, which is not easily damaged and good durability for long use.","SATISFY DIFFERENT NEEDS: BGA stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.","The tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature, and it can improve performance and reliability.","EASY TO CARRY: The stencil has a compact appearance and is easy to carry around and use."]