WIVIE Sn96.5/Ag3/Cu0.5 Lead-Free Solder Paste, 217°C Melting Point, T4 Particle (60g)

["Premium SAC305 Alloy - Sn96.5/Ag3/Cu0.5 Composition Ensures Strong Welding Joints And Oxidation Resistance.​","Low-Temp Melting At 217°C - Prevents Pcb And Component Damage During Soldering.​","T4 Fine Particle Size (20-38μm) - Ideal For Precision Stencil Printing And Mini-Component Soldering.​","No-Clean Flux Residue - Non-Corrosive, Non-Conductive, And Requires No Post-Cleaning.​","Wide Applications - Suitable For BGA, SMT and PCB Repairs In Consumer Electronics.​"]